Kingston Memory KSM26ED8-32HC 32GB 2666MHz DDR4 ECC CL19 DIMM 2Rx8 Hynix C

Kingston Memory KSM26ED8/32HC 32GB 2666MHz DDR4 ECC CL19 DIMM 2Rx8 Hynix C 

KSM26ED8/32HC
32GB 2Rx8 4G x 72-Bit PC4-2666
CL19 288-Pin DIMM

DESCRIPTION
Kingston's KSM26ED8/32HC is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, ECC, memory module, based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Data transfer rates: PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
• Low-power auto self-refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• Temperature sensor with integrated SPD
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.23” (31.25mm)
• RoHS Compliant and Halogen-Free

CL(IDD)
19 cycles
Row Cycle Time (tRCmin)
45.75ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin)
32ns(min.)
Maximum Operating Power
UL Rating
94 V - 0
Operating Temperature
0^o C to +85^o C
Storage Temperature
-55^o C to +100^o C
Item Dimension (L"xW"xH")
1 x 2 x 7

Weight
1 lb

Warranty Information
Lifetime